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HP 2G1I Twr I3-14100 8 256 Uma Dos 2Y

HP
Code:B6XU5ETSKU:294e2bfc36f7886cbbb755b04b1344aa
3.427 Lei
Supplier stock
Delivery in max. 7 business days
Warranty 24 months
Fast delivery
14-day returns
Desktop HP ProDesk 2 G1i E Tower, Intel Core i3-14100 4-Core (3.5GHz, up to 4.7GHz, 12MB), video integrat Intel UHD Graphics, RAM 8GB DDR5 4800MHz (1x8GB), SSD 256GB M.2 2280 PCIe NVMe, no ODD, LAN 10/100/1000, WLAN Realtek 8852BE-VT Wi-Fi 6 +Bluetooth 5.4, porturi: 4x USB 2.0 Type- A/ 3x USB Type-A 5Gbps/ 1x USB Type-C 10Gbps/ 1x HDMI 1.4b/ 1x DP 1.4a/ 1x RJ-45/ 1x headphones/ microphone, sloturi: 2 x M.2; 1 x PCIe 3 x1; 1 x PCIe 4 x16, No Included Keyboard, No Included Mouse, Realtek ALC3602- CG codec, Sursa 180W, Black, greutate 6.75Kg, Free DOS, 2yw Onsite
Wi-FIYes
BluetoothYes
HP DocumentationYes
HP segmentBusiness
HP Support AssistantYes
HP Security toolsPadlock loop; Trusted Platform Module (TPM) 2.0; Integrated accessories cable lock; Slim cable lock
Operating system installedFreeDOS
Processor familyIntel® Core™ i3
Processor modeli3-14100
Processor generationIntel® Core™ i3 (14th gen)
NVMeYes
Cable lock slotYes
Chassis typeTower
Product colourBlack
Country of originChina
Introduction year2025
Number of 3.5 bays1
Colour nameJack black
Product typePC
Display includedNo
PCI Express x1 (Gen 3.x) slots1
PCI Express x16 (Gen 4.x) slots1
Memory slots2x DIMM
Power Supply280 W
Weight5.98 kg
On-board graphics card modelIntel UHD Graphics 730
On-board graphics card familyIntel® UHD Graphics
On-board graphics cardYes
Discrete graphics cardNo
Discrete graphics card modelNot available
On-board GPU manufacturerIntel
UNSPSC-code43211507
Memory layout (slots x size)1 x 8 GB
Memory clock speed4800 MHz
Total storage capacity256 GB
Internal memory typeDDR5-SDRAM
Bluetooth version5.4
Password protectionYes
Wi-Fi standardsWi-Fi 6 (802.11ax)
WLAN controller modelRealtek RTL8852BE-VT
Top Wi-Fi standardWi-Fi 6 (802.11ax)
Antenna type2x2
Ethernet LANYes
Ethernet LAN data rates10,100,1000 Mbit/s
WLAN controller manufacturerRealtek
Password protection typeBIOS, Power on
Cabling technology10/100/1000Base-T(X)
Operating temperature (T-T)-5 - 35 °C
Operating relative humidity (H-H)15 - 80%
Package height287 mm
Package width499 mm
Package weight9.05 kg
Package depth400 mm
Motherboard chipsetIntel H770
Market positioningProven productivity
Trusted Platform Module (TPM)Yes
Trusted Platform Module (TPM) version2.0
Combo headphone/mic portYes
USB 3.2 Gen 2 (3.1 Gen 2) Type-C ports quantity1
HDMI ports quantity1
HDMI version1.4b
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity3
Line-inYes
USB 2.0 ports quantity4
DisplayPort version1.4a
Line-outYes
USB 3.2 Gen 1 (3.1 Gen 1) Type-C ports quantity0
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity0
Microphone inYes
Ethernet LAN (RJ-45) ports1
Serial ports quantity1
Thunderbolt 3 ports quantity0
DisplayPorts quantity1
Performance-core base frequency3.5 GHz
Processor base power60 W
Efficient cores0
Maximum turbo power110 W
Processor cache typeL3
Processor threads8
Processor cores4
Processor boost frequency4.7 GHz
Performance-core Max Turbo Frequency4.7 GHz
Performance cores4
Processor manufacturerIntel
Processor cache12 MB
Intel® Turbo Boost TechnologyYes
Number of storage drives installed1
Storage mediaSSD
Optical drive typeNo
Number of SSDs installed1
SSD form factorM.2
SSD capacity256 GB
SSD interfacePCI Express
Total SSDs capacity256 GB
Height155 mm
Depth308 mm
Width155 mm
DT-CPUIntel
DT-FormatTower
Model-procesorIntel-Core-i3

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